The year 2021 was associated with the rise of MediaTek to the top manufacturers of mobile chips. This Taiwanese company managed to attract the attention of many smartphone manufacturers in the world by releasing Dimensity series chips last year. However, in the flagship chip market, Qualcomm is still the leader. The thermal problems of the Snapdragon 8 generation 1 chip initially marked a troubled start for the American company. However, most of the smartphone manufacturers finally preferred the use of this chip to the Dimensity 9000 model made by Mediatek.
Thus, only a few limited smartphones with the high-end MediaTek chip were produced and launched. Qualcomm has been in the spotlight with the release of Snapdragon 8 Plus 1st generation chip. This semiconductor is manufactured using TSMC’s 4nm process. Qualcomm is still committed to continue working with TSMC, and yesterday the details of Snapdragon 8 generation 2 and Snapdragon 7 generation 2 chips were published on the web.
The Snapdragon 8 generation 2 chip will surpass the Dimensity 9000 series processor in terms of performance.
According to the rumors, Qualcomm will unveil the Snapdragon 8 generation 2 chip by the end of November. Xiaomi and Motorola are trying to use this chip in their products for the first time. Xiaomi plans to use Qualcomm’s upcoming flagship processor for the first time in the Xiaomi 13 series handsets. According to information published by a whistleblower with the ID Digital Chat Station, the Snapdragon 8 generation 2 chip will likely have certain advantages compared to the Dimensity 9 series.
In addition, Qualcomm will probably take the lead and launch its flagship chip before MediaTek. This scenario will also be true for the Snapdragon 7 generation 2 chip. According to this whistleblower, Qualcomm will refuse to hand over its chip manufacturing orders to Samsung. In other words, the Snapdragon 7 generation 2 chip will be produced using TSMC’s process technology. Mid-range chip production is progressing well. However, this chip will probably be placed in a lower position compared to Mediatek’s Dimensity 8000 series chips. All these processors will be produced by TSMC.
According to predictions, the Snapdragon 8 generation 2 chip will use the latest technologies updated by ARM in the ARMv9 standard. It is expected that this chip will use 4+3+1 core architecture. Therefore, this chip will probably be equipped with one Cortex X3 core, three Cortex A715 cores and four Cortex A510 version 2 cores. Currently, limited details have been released about the Snapdragon 7 generation 2 chip; But this semiconductor is expected to be launched in 2023.
Qualcomm plans to leave Samsung behind and in the future to hand over the production of all its chips to TSMC.
It is interesting to note that the whistleblower has also described how to reduce Samsung’s reputation in the field of chip production. Following the emergence of thermal and performance problems in the Snapdragon 8 generation 1 chip, Qualcomm decided to transfer the production of its chips to TSMC. However, Qualcomm will probably transfer the production of Snapdragon 6 series chips and chipsets for wearable gadgets to Samsung.
According to Digital Chat Station, Samsung will even use the 1st generation Snapdragon 7 chip in one of its upcoming smartphones. Currently, the identity of this gadget has not been determined. Currently, TSMC is witnessing a boom in its business with orders for the production of 4nm chips. Apple, Qualcomm and MediaTek are among TSMC’s customers. According to reports, this Taiwanese company has started trial production of its 3nm chips.