Qualcomm and MediaTek’s future flagship chips will be produced by TSMC


The thermal and performance problems of the Snapdragon 8 generation 1 chip made Qualcomm abandon the use of Samsung’s 4 nm production process and produce the Snapdragon 8 Plus generation 1 chip using TSMC’s 4 nm process. The use of TSMC’s advanced 4nm process resulted in significant improvements in CPU and GPU performance, significantly improving the chip’s energy efficiency and thermal performance over its peers. Meanwhile, Snapdragon 8 generation 1, Snapdragon 888 Plus and Snapdragon 888 chips were all produced using Samsung’s 4 and 5 nm processes.

Therefore, with the publication of press reports about the poor performance of previous Snapdragon flagship chips and the problems related to quality control and excessive heat production in these chips, Qualcomm finally decided to abandon the cooperation with Samsung and to produce its own flagship chips, especially the Snapdragon 8 series. will cooperate with the Taiwanese company TSMC.


A well-known and reliable Chinese whistleblower with the ID Digital Chat Station announced via a post on the Weibo social network that in the future, Qualcomm and MediaTek’s flagship smartphone chips will be manufactured by TSMC’s semiconductor production lines. In this post, it is mentioned that the 4 upcoming Qualcomm and MediaTek chips named Snapdragon 8 Gen 2, Dimensity 9100, Snapdragon 7 Gen 2 and Dimensity 8200 will be manufactured by TSMC.

According to industry insiders, the development process of Qualcomm’s Snapdragon 8 generation 2 chip has progressed at a higher speed compared to Mediatek’s Dimensity 9100 chip. Also, the development process of Snapdragon 7 generation 2 chip has progressed faster compared to Dimensity 8200. According to rumors, Snapdragon 8 generation 2 and Dimensity 9100 chips will be used in a large number of Android flagships in 2023; While Snapdragon 7 generation 2 and Dimensity 8200 chips will be used for mid-range Android gadgets.

This report also notes that the Snapdragon 7 generation 2 chip is considered an evolved version of Snapdragon 7 generation 1 and will be released to the market without changes in the arrangement of processing cores and ISPs with limited modifications. In fact, the main difference between these 2 semiconductors is related to the process used to produce them. The 1st generation Snapdragon 7 chip is manufactured using Samsung’s 4nm process; While Snapdragon 7 generation 2 will benefit from TSMC’s 4nm production process. Since the next generation chip of the Snapdragon 7 series is considered an evolved version of the previous generation chip; Therefore, instead of Snapdragon 7 generation 2, it can be named Snapdragon 7 Plus generation 1.

Regarding the popularity of Snapdragon 7 generation 1 chip, it should be noted that currently only one smartphone in the market uses this semiconductor. This mid-range handset is named Oppo Reno 8 Pro and is exclusively available in the Chinese market. The bad reputation of the Qualcomm chips produced by Samsung probably makes the acceptance of the Snapdragon 7 generation 1 chip by smartphone manufacturers not so impressive. Meanwhile, the Snapdragon 778G and Snapdragon 778G Plus chips are manufactured using TSMC’s 6nm process and are considered a more common option for smartphone manufacturers.

Currently, 3 different handsets use the Snapdragon 778G Plus chip with high energy efficiency. One of these handsets is named Honor 70; A gadget that was introduced last week during the IFA 2022 exhibition in Berlin. Another handset is called Nothing Phone (1); A gadget that was recently developed by Carl P. The founder of OnePlus was introduced. The third smartphone is Motorola Edge 30; A gadget that is launched from the raw version of Android with a minimum number of unnecessary programs.

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Adib Zahedi is the CEO and Founder of He has nearly a decade of experience in IT, including two years spent working on a Youtube Chennal. He is also an author and writes articles for Has articles include tutorials and covers everything from Windows PCs to smartphone's software.

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